ENGINEER PAD 8.5"x11" BUFF
Item # 95182- Paper Color: BUFF
- Engineering Pad
- 100 sheets of 16# buff bond paper
- 5x5 printed back enclosed grid
- Glued construction, polywrapped
- 3-hole punched
- Sheet Size: 8.5" x 11"
Excellent pad for usage in engineering classes and labs. Smooth, buff-shade 16# writing paper is plain, except for printed outline box on top of sheet, and has 5 square/inch grid layout printed on back of sheet. Back grid shows through to front as dimensional guide for drawings and layouts. 34 pt chipboard backs add stability. Glued along 8.5″ (top) edge and 3-hole punched to fit in standard 3-ring binders. Sheet size is 8.5″ x 11″. 100 sheets per pad. Each pad is polywrapped. Proudly made in USA!
| Back Material | White chipboard |
|---|---|
| Binding | Glued Pad |
| Binding Edge | 8 1/2" |
| Construction | Glued only |
| Paper | 16# tablet |
| Paper Color | Buff |
| Polywrapped? | Yes |
| Post-Consumer Recycled Content | 0 |
| Printing | Outline Front / 5x5 Enclosed Grid On Back |
| Punched/Unpunched | 3-hole punched |
| Sheet Size | 8 1/2" x 11" |
| Sheets per book | 100 |